| SEE/MAPLD Poster Session Wednesday May 21st |
5:30PM - 7:30PM |
| An Electric Power Supply Design for the SPICA CubeSat Rachid Darbali-Zamora, University of Puerto Rico-Mayaguez |
| SEE Response of a High Density SSRAM Craig Hafer, Aeroflex Microelectronics Solutions - HiRed |
| Low energy (3-6 AMeV) ion beam-line for SEE Testing at U400R FLNR JINR Cyclotron Semen Mitrofanov, Flerov Laboratory of Nuclear Reactions (FLNR) of the Joint Institute for Nuclear Research (JINR) |
| Resources for Radiation Test Data Martha O'Bryan, AS&D Inc., NASA/GSFC |
| Short Pulsed X-ray Induced Transients in the LM124 Operational Amplifier, the LM139 Comparator, and the Centronics ODS15-5T Photodiode David Cardoza, The Aerospace Corporation |
| Selection of the Eletronic Components SET Test Results Aleksandr Koziukov, Institute of Space Device Engineering (ISDE) |
| A new way to let the operating system harden its application processes against SEU Emery Kouassi Assogba, Université Catholique de Louvain/ICTEAM |
| All-Digital Baseband 65nm PLL/FPLL Clock Multiplier using 10-cell Library Robert Shuler, NASA/JSC |
| Comparison of Single Event Transients in Ground-Plane (GP)-FinFETs vs. SOI-FinFETs Mehdi Saremi, Arizona State University |
| A New SEU-Tolerant TDICE Storage Cell Li Chen, University of Saskatchewan |
| Simultaneous Switching Noise Effects in Space Qualified FPGAs John Aschenbrenner, et al., AEi Systems, LLC |
General Chair(s): Robert Weller, Vanderbilt University (SEE) / Tim Gallagher, Lockheed Martin (MAPLD)
Technical Program Chair(s): Ethan Cannon, Boeing (SEE) / Gabe Mounce, USAF and Michael Coe, SEAKR (MAPLD)
Poster Session Chair(s): Nathaniel Dodds, Sandia and Martha O'Bryan, AS and D, Inc. / GSFC
Publications Chair(s): Mike Wirthlin, BYU and Steven Buchner, NRL
Industrial Exhibit Chairwoman: Teresa Farris, Aeroflex Corp.
Treasurer: Bill Lotshaw, The Aerospace Corporation
Local Arrangements & Registration Services: Susan Hunt, STAMP Services
Website Curator: Carl Szabo, AS and D, Inc. / GSFC
SEE Symposium and MAPLD are supported by the Aeroflex Corporation, the Aerospace Corporation, Brigham Young University, Lockheed Martin, the NASA Electronic Parts and Packaging Program, the Naval Research Laboratory, Sandia National Laboratories, and Vanderbilt University.