E.M.P. Consultants
contact: Thomas M. Jordan
email: tj@empc.com
phone: 301-869-2317
web: www.empc.com
Aeroflex Divisions (2 booths)
contact: Teresa Farris
email: teresa.farris@aeroflex.com
phone: 719-594-8035
web: www.aeroflex.com/HiRel
NASA Electronic Parts and Packaging (NEPP) Program
contact: Ken LaBel
email: kenneth.a.label@nasa.gov
phone: 301-286-9936
web: http://nepp.nasa.gov/
Robust Chip Inc.
contact: Klas Lilja
email: klas.lilja@robustchip.com
phone: 925-425-0820
web: www.robustchip.com
The Boeing Company
contact: AJ Kleinosowski
PO Box 3707, Mail Code 42-57
Seattle, WA 98124
phone: 253-657-5227
web: www.boeing.com/ssed
Micro-RDC
contact: Joe Cuchiaro
email: joe.cuchiaro@micro-rdc.com
phone: 719-531-0805
web: www.micro-rdc.com
US Semiconductor
contact: Penny Meeker
email: pennym@us-semi.com
phone: 816-373-2500
web: www.us-semi.com
Mentor Graphics
contact: Golbue Baghai
email: Golbue_Baghai@mentor.com
phone: 510-354-7433
web: www.mentor.com
Maxwell Technologies
contact: Michael Dowd
email: mdowd@maxwell.com
phone: 858-503-3327
web: www.maxwell.com
Peregrine Semiconductor Corp.
contact: Cindy Trotto
email: ctrotto@psemi.com
phone: 602-750-7203
web: www.psemi.com
General Chair: Veronique Ferlet-Cavrois, European Space Agency
Technical Program Chair: Nadim Haddad, BAE Systems
Local Arrangements & Industrial Exhibit Chairwoman: Penny Meeker, US-Semi Conductor Corporation
Treasurer: Bill Lotshaw, The Aerospace Corporation
Registration Services: Susan Hunt, Stamp Services
The Symposium is supported by the Defense Threat Reduction Agency, the NASA Electronic Parts and Packaging Program, The Aerospace Corporation, the Naval Research Laboratory, and Vanderbilt University.