Monday, 2 April |
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5:00 - 8:00 PM | Registration/Reception | |
5:00 - 8:00 PM | Industrial Exhibit Setup | |
Tuesday, 3 April |
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7:30 - 8:30 AM | Continental Breakfast | |
8:30 AM | B. Wilson | Welcome and Local Arrangements |
8:35 AM | C. Hafer | Introduction to Technical Program |
Invited Talk |
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8:40 AM | Robert Patti, Tezzaron Semiconductor | 3D Integrated Circuits: A New Dimension of Design |
Session A: Design and Process Hardening |
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Chair: Daniel Loveless, Vanderbilt University |
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9:30 AM | W. Burke, Micro-RDC | Novel Mitigation Techniques for Reconfigurable Computers for Space Application |
9:50 AM | A. Zanchi, Aeroflex Colorado Springs | Single Event Functional Interrupt Location and Elimination via Pulsed Laser Scanning on a RadHard CMOS 16-bit ADC |
10:10 AM | V. Savulimedu Veeravalli, Vienna University of Technology | Efficient Radiation-Hardening of a Muller C-Element |
10:30 - 11:00 AM | Break | |
11:00 AM | C. Boatella Polo, ESA ESTEC | SEL mitigation and testing on ASIC VA32TA2.2 and ADC AD9814 |
11:20 AM | N. Atkinson, Vanderbilt University | The Quad-Path Hardening Technique for Switched-Capacitor Circuits |
11:40 AM | R. Blaine, Vanderbilt University | RHBD Techniques for CMOS Operational Amplifier Design |
12:00 - 1:00 PM | Lunch | |
Invited Talk |
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1:10 PM | Melanie Berg, MEI Technologies | Characterizing Data Path Single Event Upsets in a Synchronous Design |
1:50 PM | P. Eaton, Micro-RDC | Multiply-Interlocked Cell Digital Logic Architecture for SEU and SET Immunity |
2:10 PM | K. Lilja, Robust Chip Inc. | Single event error rate reduction for 28nm bulk technology flip-flops through simulation and layout optimization |
Session B: Single Event Test Facilities |
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Chair: Dave Hansen, Maxwell Technologies |
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2:30 PM | V. Skuratov, Joint Institute for Nuclear Research | Challenges of Rate Estimation for Destructive and Disruptive Single-Event Effects |
2:50 - 3:20 PM | Break | |
Session C: SEE on Commercial Memories |
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Chair: Ray Ladbury, NASA/GSFC |
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3:20 PM | C. Hafer, Aeroflex Colorado Springs | Commercial NOR Flash SEE Test Results |
3:50 PM | S. Guertin, JPL/NASA | Analysis of SDRAM SEFIs |
4:10 PM | G. Magistrati, ESA ESTEC | NAND Flash Storage Technology for Mission-critical Space Applications |
5:30 - 8:00 PM | Reception and Industrial Exhibits |
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5:30 - 6:30 PM | Cocktails and Appetizers | |
6:30 - 8:00 PM | Reception | |
8:00 - 10:00 PM | Teardown for Industrial Exhibits | |
Wednesday, 4 April
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7:30-8:30 AM | Continental Breakfast | |
Session C: SEE on Commercial Memories |
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Chair: Ray Ladbury, NASA/GSFC |
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8:30 AM | B. Sierawski, Vanderbilt University | The Effect of Muon Ionization on the Soft Error Reliability of Deep-Submicron SRAMs |
8:50 AM | N. Rezzak, Vanderbilt University | Single event latch-up in 130 nm and 65 nm SRAM cells |
Session D: Single-Event Transients |
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Chair: Hugh Barnaby, Arizona State University |
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9:10 AM | F. Wrobel, Universite Montpellier 2 | Alpha particle-induced transient currents in 65 nm and 40 nm technologies |
9:30 AM | D. Cardoza, The Aerospace Corporation | Single Event Transients Induced by the Absorption of Picosecond X-ray Pulses |
9:50 AM | N. Roche, Universite Montpellier 2 | The Effects of Dynamic Parameter Modification on ASET Sensitivity in a Shunt Voltage Reference |
10:10 - 10:40 AM | Break | |
10:40 AM | P. Maillard, Vanderbilt University | SET Characterization of Two 90 nm Voltage Controlled Delay Line (VCDL) Topologies |
11:00 AM | J. Warner, Naval Research Laboratory | Proton Induced Charge Collection Transients in GaAs and InAs FETs |
11:20 AM | J. Gleason, Arizona State University | Transient Radiation-Induced Capacitance Variation in Silicon PN Junctions |
11:40 AM | R. Shuler, NASA JSC | Wide Range SET Pulse Measurement |
12:00 - 1:00 PM | Lunch | |
Session E: Single-Event Test Methods |
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Chair: Jim Schwank, Sandia |
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1:10 PM | T. Oldham, Dell Services Federal Government | Correlation of Pulsed Laser Results with Milli-Beam Heavy Ion Results for NAND Flash Memory |
1:30 PM | M. Clemens, Vanderbilt University | Cross Comparison of SEU and MCU Responses of a 65 nm SRAM to 14 MeV and Terrestrial Neutrons |
1:50 PM | D. Loveless, ISDE/Vanderbilt University | Evaluation of Built-In-Self-Test Circuitry for Single-Event Transient Measurements in 45 nm SOI |
2:10 PM | E. Cannon, The Boeing Company | Rate of SEU from Two-Node Events |
2:30 PM | D. McMorrow, Naval Research Laboratory | Pulsed-Laser-Induced Single-Event Effects: Recent Results and Developments |
2:50 - 3:20 PM | Break | |
Open Learning Forum |
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Moderator: Bill Heidergott, General Dynamics AIS |
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3:20 PM | Nathaniel Dodds, Vanderbilt University | Challenges with Laser SEE Testing due to Reflections from Metal Lines |
4:00 PM | Stephen Buchner, NRL | Reflections on Current Single Event Effects Challenges |
4:40 PM | Ken LaBel, NASA/GSFC | SEE Test Planning |
5:20 PM | End of Open Learning Forum | |
6:00 - 8:00 PM | Happy Hour | |
Thursday, 5 April |
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7:30 - 8:30 AM | Continental Breakfast | |
Session F: Destructive SEE |
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Chair: Steve Guertin, NASA/JPL |
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8:30 AM | R. Ladbury, NASA Goddard Space Flight Center | Assessing Part-to-Part Variation for Destructive Single-Event Effects |
8:50 AM | V. Senaj, CERN | Non-destructive SEB test of HV GTO-like thyristors |
Session G: Product, Technology, System SEE |
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Chair: Jerry Wert, Boeing |
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9:10 AM | A. Lesea, Xilinx | SER from 250nm to 28nm |
9:30 AM | A. Touboul, Montpellier 2 University | Trench Fieldstop IGBT failures at ground level |
9:50 AM | M. Cassel, EADS Astrium GmbH | Handling of Radiation-Induced and Inherent Effects of NAND-Flash Memory Devices on the Sentinel 2 MMFU |
10:10 - 10:30 AM | Break | |
10:30 AM | T. Dargnies, 3D Plus USA | Electrical Performances and Radiation Qualification Tests Results of a Highly Integrated and Space Qualified Point of Load Converter |
10:50 AM | S. Jagannathan, Vanderbilt University | Frequency Dependence of Alpha-particle Induced Soft Error Rates of Flip-flops in 40 nm CMOS Technology |
11:10 AM | End of Technical Session | |
2:00 PM | Volleyball Session ?? | Chair: TBD |
General Chair: Bruce Wilson, DTRA
Technical Program Chair: Craig Hafer, Aeroflex
Local Arrangements & Industrial Exhibit Chairwoman: Susan Hunt, Stamp Services
Treasurer: Bill Lotshaw, The Aerospace Corporation
Registration Services: Susan Hunt, Stamp Services
The Symposium is supported by the Defense Threat Reduction Agency, the NASA Electronic Parts and Packaging Program, The Aerospace Corporation, the Naval Research Laboratory, and Vanderbilt University.