2012 SEE Symposium PRELIMINARY Agenda

Monday, 2 April
5:00 - 8:00 PM Registration/Reception
5:00 - 8:00 PM Industrial Exhibit Setup
Tuesday, 3 April
7:30 - 8:30 AM Continental Breakfast
8:30 AM B. Wilson Welcome and Local Arrangements
8:35 AM C. Hafer Introduction to Technical Program
Invited Talk
8:40 AM Robert Patti, Tezzaron Semiconductor 3D Integrated Circuits: A New Dimension of Design
Session A: Design and Process Hardening
Chair: Daniel Loveless, Vanderbilt University
9:30 AM W. Burke, Micro-RDC Novel Mitigation Techniques for Reconfigurable Computers for Space Application
9:50 AM A. Zanchi, Aeroflex Colorado Springs Single Event Functional Interrupt Location and Elimination via Pulsed Laser Scanning on a RadHard CMOS 16-bit ADC
10:10 AM V. Savulimedu Veeravalli, Vienna University of Technology Efficient Radiation-Hardening of a Muller C-Element
10:30 - 11:00 AM   Break
11:00 AM C. Boatella Polo, ESA ESTEC SEL mitigation and testing on ASIC VA32TA2.2 and ADC AD9814
11:20 AM N. Atkinson, Vanderbilt University The Quad-Path Hardening Technique for Switched-Capacitor Circuits
11:40 AM R. Blaine, Vanderbilt University RHBD Techniques for CMOS Operational Amplifier Design
12:00 - 1:00 PM   Lunch
Invited Talk
1:10 PM Melanie Berg, MEI Technologies Characterizing Data Path Single Event Upsets in a Synchronous Design
1:50 PM P. Eaton, Micro-RDC Multiply-Interlocked Cell Digital Logic Architecture for SEU and SET Immunity
2:10 PM K. Lilja, Robust Chip Inc. Single event error rate reduction for 28nm bulk technology flip-flops through simulation and layout optimization
Session B: Single Event Test Facilities
Chair: Dave Hansen, Maxwell Technologies
2:30 PM V. Skuratov, Joint Institute for Nuclear Research Challenges of Rate Estimation for Destructive and Disruptive Single-Event Effects
2:50 - 3:20 PM   Break
Session C: SEE on Commercial Memories
Chair: Ray Ladbury, NASA/GSFC
3:20 PM C. Hafer, Aeroflex Colorado Springs Commercial NOR Flash SEE Test Results
3:50 PM S. Guertin, JPL/NASA Analysis of SDRAM SEFIs
4:10 PM G. Magistrati, ESA ESTEC NAND Flash Storage Technology for Mission-critical Space Applications
5:30 - 8:00 PM
Reception and Industrial Exhibits
5:30 - 6:30 PM Cocktails and Appetizers
6:30 - 8:00 PM Reception
8:00 - 10:00 PM Teardown for Industrial Exhibits
Wednesday, 4 April
7:30-8:30 AM Continental Breakfast
Session C: SEE on Commercial Memories
Chair: Ray Ladbury, NASA/GSFC
8:30 AM B. Sierawski, Vanderbilt University The Effect of Muon Ionization on the Soft Error Reliability of Deep-Submicron SRAMs
8:50 AM N. Rezzak, Vanderbilt University Single event latch-up in 130 nm and 65 nm SRAM cells
Session D: Single-Event Transients
Chair: Hugh Barnaby, Arizona State University
9:10 AM F. Wrobel, Universite Montpellier 2 Alpha particle-induced transient currents in 65 nm and 40 nm technologies
9:30 AM D. Cardoza, The Aerospace Corporation Single Event Transients Induced by the Absorption of Picosecond X-ray Pulses
9:50 AM N. Roche, Universite Montpellier 2 The Effects of Dynamic Parameter Modification on ASET Sensitivity in a Shunt Voltage Reference
10:10 - 10:40 AM   Break
10:40 AM P. Maillard, Vanderbilt University SET Characterization of Two 90 nm Voltage Controlled Delay Line (VCDL) Topologies
11:00 AM J. Warner, Naval Research Laboratory Proton Induced Charge Collection Transients in GaAs and InAs FETs
11:20 AM J. Gleason, Arizona State University Transient Radiation-Induced Capacitance Variation in Silicon PN Junctions
11:40 AM R. Shuler, NASA JSC Wide Range SET Pulse Measurement
12:00 - 1:00 PM   Lunch
Session E: Single-Event Test Methods
Chair: Jim Schwank, Sandia
1:10 PM T. Oldham, Dell Services Federal Government Correlation of Pulsed Laser Results with Milli-Beam Heavy Ion Results for NAND Flash Memory
1:30 PM M. Clemens, Vanderbilt University Cross Comparison of SEU and MCU Responses of a 65 nm SRAM to 14 MeV and Terrestrial Neutrons
1:50 PM D. Loveless, ISDE/Vanderbilt University Evaluation of Built-In-Self-Test Circuitry for Single-Event Transient Measurements in 45 nm SOI
2:10 PM E. Cannon, The Boeing Company Rate of SEU from Two-Node Events
2:30 PM D. McMorrow, Naval Research Laboratory Pulsed-Laser-Induced Single-Event Effects: Recent Results and Developments
2:50 - 3:20 PM   Break
Open Learning Forum
Moderator: Bill Heidergott, General Dynamics AIS
3:20 PM Nathaniel Dodds, Vanderbilt University Challenges with Laser SEE Testing due to Reflections from Metal Lines
4:00 PM Stephen Buchner, NRL Reflections on Current Single Event Effects Challenges
4:40 PM Ken LaBel, NASA/GSFC SEE Test Planning
5:20 PM End of Open Learning Forum  
6:00 - 8:00 PM   Happy Hour
Thursday, 5 April
7:30 - 8:30 AM Continental Breakfast
Session F: Destructive SEE
Chair: Steve Guertin, NASA/JPL
8:30 AM R. Ladbury, NASA Goddard Space Flight Center Assessing Part-to-Part Variation for Destructive Single-Event Effects
8:50 AM V. Senaj, CERN Non-destructive SEB test of HV GTO-like thyristors
Session G: Product, Technology, System SEE
Chair: Jerry Wert, Boeing
9:10 AM A. Lesea, Xilinx SER from 250nm to 28nm
9:30 AM A. Touboul, Montpellier 2 University Trench Fieldstop IGBT failures at ground level
9:50 AM M. Cassel, EADS Astrium GmbH Handling of Radiation-Induced and Inherent Effects of NAND-Flash Memory Devices on the Sentinel 2 MMFU
10:10 - 10:30 AM   Break
10:30 AM T. Dargnies, 3D Plus USA Electrical Performances and Radiation Qualification Tests Results of a Highly Integrated and Space Qualified Point of Load Converter
10:50 AM S. Jagannathan, Vanderbilt University Frequency Dependence of Alpha-particle Induced Soft Error Rates of Flip-flops in 40 nm CMOS Technology
11:10 AM End of Technical Session
2:00 PM Volleyball Session ?? Chair: TBD



General Chair: Bruce Wilson, DTRA
Technical Program Chair: Craig Hafer, Aeroflex
Local Arrangements & Industrial Exhibit Chairwoman: Susan Hunt, Stamp Services
Treasurer: Bill Lotshaw, The Aerospace Corporation
Registration Services: Susan Hunt, Stamp Services

The Symposium is supported by the Defense Threat Reduction Agency, the NASA Electronic Parts and Packaging Program, The Aerospace Corporation, the Naval Research Laboratory, and Vanderbilt University.