2012 SEE Symposium Exhibitors

Aeroflex
contact: Teresa Farris
phone: 719-594-8035
email: teresa.farris@aeroflex.com
web: www.aeroflex.com/HiRel

Robust Chip Inc.
contact: Klas Lilja
phone: 925-425-0820
email: klas.lilja@robustchip.com
web: www.robustchip.com

ISDE/Vanderbilt University
Contact: Becky Borsody
Phone: 615-343-5669
email: becky.borsody@vanderbilt.edu
web: isde.vanderbilt.edu

The Boeing Company
Contact: April Fagan
Phone: 206-544-7522
email: april.fagan@boeing.com
web: www.boeing.com/ssed

Micro-RDC
Contact: Joe Cuchiaro
phone: 719-358-5453
email: Joe.cuchiaro@micro-rdc.com
web: www.micro-rdc.com

Space Micro
Contact: Alyson Varner
phone: 858-332-0700 x143
email: avarner@spacemicro.com
web: www.spacemicro.com

NASA Electronic Parts and Packaging (NEPP) Program
contact: Ken LaBel
phone: 301-286-9936
email: kenneth.a.label@nasa.gov
web: nepp.nasa.gov

BAE Systems
Contact: Donald Francis
Phone: 703-367-6638
email: don.francis@baesystems.com
web: www.baesystems.com

CONTACT US

General Chair: Bruce Wilson, DTRA
Technical Program Chair: Craig Hafer, Aeroflex
Local Arrangements & Industrial Exhibit Chairwoman: Susan Hunt, Stamp Services
Treasurer: Bill Lotshaw, The Aerospace Corporation
Registration Services: Susan Hunt, Stamp Services

The Symposium is supported by the Defense Threat Reduction Agency, the NASA Electronic Parts and Packaging Program, The Aerospace Corporation, the Naval Research Laboratory, and Vanderbilt University.