SEE Symposium 2011 Exhibitors

E.M.P. Consultants
contact: Thomas M. Jordan
email: tj@empc.com
phone: 301-869-2317
web: www.empc.com

Aeroflex Divisions (2 booths)
contact: Teresa Farris
email: teresa.farris@aeroflex.com
phone: 719-594-8035
web: www.aeroflex.com/HiRel

NASA Electronic Parts and Packaging (NEPP) Program
contact: Ken LaBel
email: kenneth.a.label@nasa.gov
phone: 301-286-9936
web: http://nepp.nasa.gov/

Robust Chip Inc.
contact: Klas Lilja
email: klas.lilja@robustchip.com
phone: 925-425-0820
web: www.robustchip.com

The Boeing Company
contact: AJ Kleinosowski
PO Box 3707, Mail Code 42-57
Seattle, WA 98124
phone: 253-657-5227
web: www.boeing.com/ssed

Micro-RDC
contact: Joe Cuchiaro
email: joe.cuchiaro@micro-rdc.com
phone: 719-531-0805
web: www.micro-rdc.com

US Semiconductor
contact: Penny Meeker
email: pennym@us-semi.com
phone: 816-373-2500
web: www.us-semi.com

Mentor Graphics
contact: Golbue Baghai
email: Golbue_Baghai@mentor.com
phone: 510-354-7433
web: www.mentor.com

Maxwell Technologies
contact: Michael Dowd
email: mdowd@maxwell.com
phone: 858-503-3327
web: www.maxwell.com

Peregrine Semiconductor Corp.
contact: Cindy Trotto
email: ctrotto@psemi.com
phone: 602-750-7203
web: www.psemi.com

CONTACT US

General Chair: Veronique Ferlet-Cavrois, European Space Agency
Technical Program Chair: Nadim Haddad, BAE Systems
Local Arrangements & Industrial Exhibit Chairwoman: Penny Meeker, US-Semi Conductor Corporation
Treasurer: Bill Lotshaw, The Aerospace Corporation
Registration Services: Susan Hunt, Stamp Services

The Symposium is supported by the Defense Threat Reduction Agency, the NASA Electronic Parts and Packaging Program, The Aerospace Corporation, the Naval Research Laboratory, and Vanderbilt University.