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To submit an abstract to SEE/MAPLD, please fill out the fields below

Guidelines for Submissions:
Abstract submissions are a minimum of 1 and a maximum of 4 pages
File format is MS Word .docx or Adobe PDF format

Abstract Submission Due Date: Friday, March 16th, 2018

After the submission due date, the workshop committee will contact all authors by email
to indicate whether their presentation(s) have been accepted or declined

Abstract Title:
First Name:
Last Name:
E-mail Address:
Completed Abstract File:
Select an appropriate session for your abstract:

(Choose One)
SEE Symposium
Combined Session
Poster Session
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Industrial Exhibit Chairwoman: Teresa Farris, Cobham Semiconductor Solutions
Local Arrangements & Registration Services: Susan Hunt, STAMP Services
Website Curator: Carl Szabo, AS and D, Inc. / GSFC

SEE Symposium and MAPLD are supported by Cobham Semiconductor Solutions, the Aerospace Corporation, Brigham Young University, Lockheed Martin, the NASA Electronic Parts and Packaging Program, the Naval Research Laboratory, Sandia National Laboratories, and Vanderbilt University.