SEE Symposium / MAPLD 2013 Logo

2013 SEE SYMPOSIUM / MAPLD Exhibitors

Aeroflex Logo
contact: Teresa Farris
phone: 719-594-8035
email: teresa.farris@aeroflex.com
web: www.aeroflex.com/HiRel

3D Plus Logo
3D Plus
contact: Mich Emond
phone: 214-733-8505
email: memond@3d-plususa.com
web: www.3dplus.com

Synopsys Logo
contact: Lindsay Cairns
phone: 650-584-4395
email: Lindsayc@synopsys.com
web: www.synopsys.com

BAE Systems Logo
BAE Manassas
contact: Laura Burcin
phone: 703-367-4507
email: laura.burcin@baesystems.com
web: www.rad750.com

Ridgetop Group, Inc. Logo
Ridgetop Group, Inc.
contact: Andrew Levy
phone: 520-742-3300
email: alevy@ridgetopgroup.com
web: www.ridgetopgroup.com

Dini Group Logo
Dini Group
contact: Rob Britton
email: rbritton@dinigroup.com
phone: 858-454-3419
web: www.dinigroup.com

E.M.P. Consultants Logo
E.M.P. Consultants
contact: Thomas M. Jordan
email: tj@empc.com
phone: 301-869-2317
web: www.empc.com

Space Micro, Inc. Logo
Space Micro, Inc.
Contact: Kelli Montigel
phone: 858-332-0700
email: kmontigel@spacemicro.com
web: www.spacemicro.com

The Boeing Company Logo
The Boeing Company
Contact: April Fagan
Phone: 206-544-7522
email: april.fagan@boeing.com
web: www.boeing.com/ssed

Robust Chip Inc. Logo
Robust Chip Inc.
contact: Klas Lilja
phone: 925-425-0820
email: klas.lilja@robustchip.com
web: www.robustchip.com

contact: Nickie Farley
phone: 702-852-4028
email: nickief@aldec.com
web: www.aldec.com

NRO Seal
National Reconnaissance Office (NRO)
contact: Kevin Donaleski
phone: 703-808-2769
email: kevin.donaleski@nro.mil
web: Dii.westfields.net

Microsemi Logo
contact: Cliff Silver
phone: 949-380-6134
email: csilver@microsemi.com
web: www.microsemi.com

The Vanderbilt ISDE Logo
ISDE/Vanderbilt University
Contact: Becky Borsody
Phone: 615-343-5669
email: becky.borsody@vanderbilt.edu
web: isde.vanderbilt.edu

TowerJazz Logo
Tower Jazz
Contact: Lauri Julian
Phone: 949-715-3049
email: lauri.julian@towerjazz.com
web: towerjazz.com

Northrop Grumman Logo
Northrop Grumman Corporation
Contact: Antoinette Lewis
Phone: 410-765-2533
email: antoinette.lewis@ngc.com
web: www.northropgrumman.com


General Chair(s): Peter McNulty, Clemson University (SEE) / Mythi To, Sandia National Laboratories (MAPLD)
Technical Program Chair(s): Leif Scheick, JPL (SEE) / Tim Gallagher, Lockheed Martin & Mike Wirthlin, Brigham Young University (MAPLD)
Industrial Exhibit Chairwoman: Teresa Farris, Aeroflex Corp.
Treasurer: Bill Lotshaw, The Aerospace Corporation
Local Arrangements & Registration Services: Susan Hunt, STAMP Services
SEE-MAPLD Steering Committee: Ken LaBel, NASA/GSFC; Jonathan Pellish, NASA/GSFC; Wes Powell, NASA/GSFC
Newcomers Sessions AV Support: Ken LaBel, NASA/GSFC

SEE Symposium and MAPLD are supported by the Aeroflex Corporation, the Aerospace Corporation, Brigham Young University, Lockheed Martin, the NASA Electronic Parts and Packaging Program, the Naval Research Laboratory, Sandia National Laboratories, and Vanderbilt University.