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Welcome to 2013 SEE Symposium and Military and Aerospace Programmable Logic Devices Home Page!

Click here to view the 2012 SEE Symposium pages

For Attendees: 2013 Registration and Preliminary Agenda

These meetings will be held from April 9-12, 2013 (Tuesday thru Friday) at the San Diego Marriott La Jolla. In 2013 these meetings will be combined at the same site over four days - one registration fee for two cutting edge, relevant meetings. The Single-Event Effects (SEE) Symposium will be held from April 9-11 and Military and Aerospace Programmable Logic Devices (MAPLD) from April 11-12. An industrial exhibit will be held on the evening of April 10th and a joint SEE/MAPLD technical session on the morning of April 11th. SEE Symposium presentations will address all aspects of single-event effects (SEE) in microelectronic and photonic devices, circuits, and systems. MAPLD presentations will explore the use of programmable devices for use in military and aerospace with an emphasis of proper operation in extreme conditions at high altitude and in space.

SEE-MAPLD is proud to announce a new feature as part of the conference week:

Newcomers' Training Sessions

The intent of these training sessions is to aid in the cross-fertilization between the two meetings. On Wed afternoon (during the SEE Symposium), a session will be held on "SEE for Newcomers". On Thurs afternoon (during the MAPLD Conference), a session will be held on "FPGAs for Newcomers". Each session will be between 2-4 hours in length and provide a mix of instructor-led training and discussion. These will be held in parallel to the regular meeting presentations. Further details will be provided as the meetings grow closer.

Once a SEE-MAPLD attendee is registered, they may sign up for either of the 2 sessions or both on a first-come, first-served (i.e., the earlier you register, the greater the chance of nabbing a slot). Space is limited and we will keep an "overflow" list in case of no shows. To sign up, register for SEE-MAPLD as an attendee (or exhibitor comp). Our registration company (STAMP Services) will then email you a signup option.

Side meeting rooms

Please remember: limited side meeting rooms will be available for one-on-one or small group meetings. We ask that you do not request a side meeting room for more than 10 people during main session hours. Contact STAMP Services for details.

Podcast option

Want to learn the latest in SEE-MAPLD to help your projects but travel budgets got you down?

Fear not, we are offering the option to purchase a podcast of the oral sessions (available for free if you are a registered attendee).
Podcast will be available after June 1, 2013 for download. See registration page to sign up.

Included: a one-time download option of the main sessions only.
NOT included: newcomers training sessions nor any one-on-one interactions with exhibitors or side meetings.

SEE Symposium MAPLD
Phenomena: Upset, Transients, Latchup, Gate Rupture, Burnout, Destructive Effects in Bipolar Devices. FPGAs, PLD and New Devices: New and/or novel FPGA, PLDs; Benchmarking of FPGAs, PLDs; Applications of spaceborne processing.
Basic Mechanisms and Modeling: Destructive and Non-Destructive Effects, Nanoscale Phenomena, Effect of Operating Speed, Charge Transport and Collection, Impact of Circuit and Environmental Parameters. Mitigation of Single event effects in PLDs, FPGAs, and commercial electronics: Multi-level approaches for high reliability and fault tolerance (redundancy, TMR, SET filtering, etc...), SEU mitigation techniques and SEE automated tools.
SEE Mitigation Methods Including Hardened by Design (HBD) and by Process: Approaches for gaining SEE hardness in commercial devices. Designing with FPGAs and PLDs: Agile methods, ESL/HLS and Model Based Engineering development techniques, embedded processing, and speeding up synthesis and PAR (NSF CHREC).
Environments and Facilities: Space, Atmospheric and Terrestrial environments. Heavy Ion, Proton, Neutron and Laser Test Facilities. Validation and Verification of FPGAs and PLDs: Verification techniques and languages such as co-simulation, System Verilog and OVM/UVM. Simulation speed-up techniques, emulation, new tools and methods for design validation.
Operational Regimes and Performance Data: Systems and Devices at LEO to Geosynchronous and Beyond, High Altitude Aircraft, and Terrestrial. Reliability/Availability/Susceptibility of programmable devices: Failure mechanisms, reliability testing and characterization, packaging reliability, reliable design practices.
Electronic & Photonic Device Data, Techniques, and Diagnostics: Memories, Latches, Analog Circuits, Microprocessors, FPGAs, Optocouplers, DC to DC Converters, Sensors, Commercial and Hardened Components, Data Capture Methods, and Data Analysis. Novel Applications and Case Studies: Reconfigurable computing, high-performance processing using programmable logic, successful deployment of programmable logic, novel applications and design studies.
Systems: Error Mitigation, Error Detection & Correction, Multi-core Processing, and Fault Tolerant Systems. Education: Education practices, market demands for military and aerospace component engineers, and engineer retention.
Event Rate Computation: Analytic, Monte Carlo, Mixed-Level (Radiation Transport + SPICE, TCAD + SPICE, etc.) Technical Management of FPGAs and PLDs: Technical leadership, process management and metrics.

For information on having an industrial exhibit please contact Teresa Farris: Teresa.Farris@Aeroflex.com



General Chair(s): Peter McNulty, Clemson University (SEE) / Mythi To, Sandia National Laboratories (MAPLD)
Technical Program Chair(s): Leif Scheick, JPL (SEE) / Tim Gallagher, Lockheed Martin & Mike Wirthlin, Brigham Young University (MAPLD)
Industrial Exhibit Chairwoman: Teresa Farris, Aeroflex Corp.
Treasurer: Bill Lotshaw, The Aerospace Corporation
Local Arrangements & Registration Services: Susan Hunt, STAMP Services
SEE-MAPLD Steering Committee: Ken LaBel, NASA/GSFC; Jonathan Pellish, NASA/GSFC; Wes Powell, NASA/GSFC
Newcomers Sessions AV Support: Ken LaBel, NASA/GSFC

SEE Symposium and MAPLD are supported by the Aeroflex Corporation, the Aerospace Corporation, Brigham Young University, Lockheed Martin, the NASA Electronic Parts and Packaging Program, the Naval Research Laboratory, Sandia National Laboratories, and Vanderbilt University.